The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2009

Filed:

Sep. 20, 2006
Applicants:

Seung Wan Lee, Suwon-si, KR;

Min Seog Choi, Seoul, KR;

Kyu Dong Jung, Suwon-si, KR;

Woon Bae Kim, Suwon-si, KR;

Inventors:

Seung Wan Lee, Suwon-si, KR;

Min Seog Choi, Seoul, KR;

Kyu Dong Jung, Suwon-si, KR;

Woon Bae Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A micro-element package which can reduce manufacturing costs and can be advantageous for mass production due to simplifying its structure and manufacturing process, and also can facilitate miniaturization and promote thinness, and a method of manufacturing the micro-element package. The micro-element package includes: a substrate having a micro-element on its top surface and a comparatively thin surrounding portion provided around the micro-element; and a circuit board that is electrically connected to the micro-element by utilizing the surrounding portion as a medium.


Find Patent Forward Citations

Lee, Seung. (2009). Micro-element package having a dual-thickness substrate and manufacturing method thereof (U.S. Patent No. 7589422). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7589422

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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