The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2009
Filed:
Jun. 30, 2006
Ajit V. Sathe, Chandler, AZ (US);
Mathew J. Manusharow, Phoenix, AZ (US);
Sung-won Moon, Phoenix, AZ (US);
Ajit V. Sathe, Chandler, AZ (US);
Mathew J. Manusharow, Phoenix, AZ (US);
Sung-Won Moon, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Application of underfill material may be controlled to minimize the formation of voids between a plurality of integrated circuit ('IC') dice and a substrate in an IC package. One or more elements are located in a gap between two dice to control the flow of underfill material and minimize the formation of voids within the underfill material. In an embodiment, an element may be an active electrical component, a passive electrical component, or a non-functional electrical component. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.