The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2009
Filed:
Aug. 06, 2007
Toshiya Satoh, Kanasago, JP;
Masahiko Ogino, Hitachi, JP;
Takao Miwa, Hitachinaka, JP;
Takashi Naitou, Mito, JP;
Takashi Namekawa, Hitachi, JP;
Toshihide Nabatame, Tsukuba, JP;
Shigehisa Motowaki, Hitachi, JP;
Toshiya Satoh, Kanasago, JP;
Masahiko Ogino, Hitachi, JP;
Takao Miwa, Hitachinaka, JP;
Takashi Naitou, Mito, JP;
Takashi Namekawa, Hitachi, JP;
Toshihide Nabatame, Tsukuba, JP;
Shigehisa Motowaki, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
Through an improvement of module size increase due to mounting a single passive element on a substrate and an increase in the mounting cost, to provide a highly reliable, high performance and small sized electronic circuit component which permits to integrate a variety of electronic parts such as capacitors, inductors and resistors in a high density with low cost. The electronic circuit component comprises an insulator substrate, a plurality of electrodes having different areas provided on the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a metal terminal part of a part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.