The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2009
Filed:
Oct. 11, 2007
Chih Pin Hung, Kaohsiung, TW;
Chi Tsung Chiu, Kaohsiung, TW;
IN DE Ou, Kaohsiung, TW;
Yung Hui Wang, Kaohsiung, TW;
Chih Pin Hung, Kaohsiung, TW;
Chi Tsung Chiu, Kaohsiung, TW;
In De Ou, Kaohsiung, TW;
Yung Hui Wang, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
An electronic package is provided. The electronic package includes a first substrate, an electronic component, a first sealant, a second substrate, a plurality of bonding wires and a second sealant, wherein the first substrate has opposing upper and lower surfaces and a plurality of bonding pads is disposed on the upper surface of the first substrate. The electronic component is positioned on the upper surface of the first substrate and electrically connected to the bonding pads. The first sealant is formed on the upper surface of the first substrate to encapsulate the electronic component. The lower surface of the second substrate is attached to the first sealant. The upper surface of the second substrate includes a central protrusion and a rim portion which surrounds and is lower than the central protrusion. A plurality of bonding wires is used to electrically connect the rim portion to the first substrate. The second sealant is formed on the upper surface of the first substrate and on the rim portion of the second substrate to encapsulate the bonding wires, the first sealant and the rim portion.