The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2009
Filed:
Jun. 23, 2006
Tatyana N. Andryushchenko, Portland, OR (US);
Anne E. Miller, Portland, OR (US);
Tatyana N. Andryushchenko, Portland, OR (US);
Anne E. Miller, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Methods of fabricating an interconnect, which fundamentally comprises forming a second conductive film (e.g., aluminum) over first conductive film (e.g., copper) deposited in an opening formed in a dielectric layer (e.g., low-k dielectric). The second conductive film has an ability to reflow to form a planar surface upon a thermal treatment process. Electropolishing is then used to planarize the second and first conductive films, wherein an electrolyte solution selective to remove the first conductive film faster than the second conductive film is used. An interconnect is formed.