The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2009
Filed:
Apr. 01, 2005
Qing Gan, Fremont, CA (US);
Robert W. Warren, Newport Beach, CA (US);
Anthony J. Lobianco, Irvine, CA (US);
Steve X. Liang, San Diego, CA (US);
Qing Gan, Fremont, CA (US);
Robert W. Warren, Newport Beach, CA (US);
Anthony J. Lobianco, Irvine, CA (US);
Steve X. Liang, San Diego, CA (US);
Skyworks Solutions, Inc., Irvine, CA (US);
Abstract
According to an exemplary embodiment, a wafer level package includes a device wafer including at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The wafer level package includes a first polymer layer situated over the device wafer. The wafer level package includes at least one passive component situated over the first polymer layer and having a first terminal and a second terminal. The first terminal of the at least one passive component is electrically connected to the at least one device wafer contact pad. The wafer level package includes a second polymer layer situated over the at least one passive component. The wafer level package includes at least one polymer layer contact pad situated over the second polymer layer and electrically connected to the second terminal of the at least one passive component.