The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2009

Filed:

Jan. 24, 2006
Applicants:

Srikanth Narasimalu, Singapore, SG;

Premkumar Jeromerajan, Singapore, SG;

Inventors:

Srikanth Narasimalu, Singapore, SG;

Premkumar Jeromerajan, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method is provided for removing excess encapsulation material from unmolded surfaces of a molded substrate including semiconductor packages by utilizing an acid solution. The method comprises the steps of mounting the substrate to a holding device with the unmolded surfaces facing an acid source for supplying an acid solution, contacting the unmolded surfaces with the acid solution for a sufficient time to remove the excess encapsulation material from the unmolded surfaces while substantially avoiding contact with molded surfaces thereof, and thereafter removing the substrate from contact with the acid solution.


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