The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2009
Filed:
Nov. 07, 2006
Les Nye, Dauphin, PA (US);
Adam Liberatore, Kuruman, ZA;
Kirk Rager, Reedsville, PA (US);
Jason Toomey, Linwood, MA (US);
Les Nye, Dauphin, PA (US);
Adam Liberatore, Kuruman, ZA;
Kirk Rager, Reedsville, PA (US);
Jason Toomey, Linwood, MA (US);
Olympus NDT, Waltham, MA (US);
Abstract
A solderless, direct cable interconnect for an array transducer and method for the fabrication thereof. An ultrasonic array transducer includes an acoustic backing layer, a piezoelectric layer containing an array of piezoelectric elements (typically created from a solid layer of piezoelectric material disposed over a matching layer cut with a dicing saw and fixed on a solid ground plane), and plurality of control wires, disposed between the backing layer and the piezoelectric layer. A solid backing material which will displace slightly at temperature and pressure is formed into the desired shape. Kerfs are precisely cut into the shaped backing material in a pattern such that they will line up with the center of each piezoelectric element in the piezoelectric layer. Signal wires are disposed across the backing material along the kerfs, and the piezoelectric layer is aligned and then compression bonded to the backing layer, encapsulating the signal wires and electrically connecting them to the piezoelectric elements without the need for an intermediate connection board or flex circuit.