The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2009
Filed:
Jun. 22, 2005
Tadahiko Sakai, Fukuoka, JP;
Tadashi Maeda, Fukuoka, JP;
Tadahiko Sakai, Fukuoka, JP;
Tadashi Maeda, Fukuoka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A method of soldering electronic component () having solder bumps () formed thereon to substrate (), wherein bumps () are pressed against a flux transferring stage on which a thin film is formed of flux () containing metal powder () of good wettability to solder so as to cause metal powder () to penetrate oxide films () and embed in the surfaces on the bottom parts of bumps (), and bumps () in this state are positioned and mounted to electrodes () on substrate (). Substrate () is then heated to melt bumps () and allow the melted solder to flow and spread along the surfaces of metal powder () toward electrodes (). The method can thus provide solder bonding portions of high quality without any soldering defect and deterioration of the insulating property.