The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2009
Filed:
Sep. 27, 2006
Applicant:
Chih-ming Hung, Kaohsiung, TW;
Inventor:
Chih-Ming Hung, Kaohsiung, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for manufacturing a stacked bump structure including the following steps is provided. First, a substrate having multiple bonding pads disposed on a surface thereof is provided. Next, a first bump and a second bump are respectively formed on any two adjacent bonding pads of the substrate. Then, a third bump is formed between the first bump and the second bump by wire bonding technology, so as to make the two adjacent bonding pads electrically connected to each other through the third bump.