The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2009

Filed:

Feb. 17, 2005
Applicant:

Yutaka Kondo, Tachikawa, JP;

Inventor:

Yutaka Kondo, Tachikawa, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 20/10 (2006.01); B23K 1/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

In an bonding apparatus, a piezoelectric elementbeing built into the vicinity of the capillary attachment portion of a bonding armso that the capillarycan be caused to vibrate in the axial direction of the bonding arm. The preparatory pressure application device that applies a preparatory pressure to the piezoelectric elementincludes two wedge-form attachment basesandwhich are disposed to the rear of or behind the piezoelectric element, and a preparatory pressure boltwhich is screwed into the wedge-form attachment basefrom the outside of the bonding arm; and a preparatory pressure is applied to the piezoelectric elementby the movement of the wedge-form attachment basein the axial direction of the bonding armcaused by the rotation of the preparatory pressure bolt


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