The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2009
Filed:
Feb. 08, 2007
Minoru Ametani, Mitaka, JP;
Minoru Ametani, Mitaka, JP;
Tokyo Seimitsu Co., Ltd., Tokyo, JP;
Abstract
A wafer processing apparatus (), for processing a wafer () with a surface protective film () attached on the front surface () on which at least one circuit pattern is formed, includes a dicing tape application unit () for attaching a dicing tape () on a frame () and the wafer, a surplus dicing tape take-up unit () for taking up the surplus part of the dicing tape attached on the frame and the wafer and a surface protective film peeling unit () for peeling the surface protective film from the wafer using a peeling tape (). At least one of the dicing tape application unit, the surplus dicing tape take-up unit and the surface protective film peeling unit is slidably arranged in that order on common rails (). As a result, tape can be loaded and the maintenance work on each unit can be carried out easily.