The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2009
Filed:
Jan. 24, 2007
Tomoko Higashino, Tokyo, JP;
Tomoko Higashino, Tokyo, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A semiconductor wafer is mounted onto a dicing tape, the dicing tape comprising a first tape easy to stretch and a second tape difficult to stretch and provided on the first tape. Thereafter, a ring-shaped jig is mounted onto the dicing tape along the outer periphery of the semiconductor wafer and the semiconductor wafer is diced. Subsequently, the dicing tape is stretched from the outer periphery thereof to widen the spacing between adjacent chips. Thus, the dicing tape is stretched from its outer periphery in a state in which there are formed an area of the dicing tape underlying the semiconductor wafer and easy to stretch and an area of the dicing tape located along the outer periphery of the wafer and difficult to stretch. Consequently, the force of stretching the dicing tape is transmitted to the semiconductor wafer-mounted area of the first tape, thus permitting pickup of each chip in a sufficiently widened state of the spacing between adjacent chip-forming areas. The semiconductor device manufactured by this method is improved in reliability.