The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7560946 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 14, 2009

Filed:

Aug. 10, 2007
Applicants:

Jeanne Paulette Spence Bickford, Essex Junction, VT (US);

John R. Goss, South Burlington, VT (US);

Nazmul Habib, South Burlington, VT (US);

Robert Mcmahon, Essex Junction, VT (US);

Inventors:

Jeanne Paulette Spence Bickford, Essex Junction, VT (US);

John R. Goss, South Burlington, VT (US);

Nazmul Habib, South Burlington, VT (US);

Robert McMahon, Essex Junction, VT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H01L 21/66 (2006.01); G06F 19/00 (2006.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of accepting semiconductor chips is provided using on-chip parametric measurements. An on-chip parametric measurement structure is determined for each parameter in a set of parametric acceptance criteria. An on-chip parametric measurement macro is included in a design of each semiconductor chip for each identified on-chip parametric measurement structure. Each on-chip parametric measurement macro is tested to determine compliance of the semiconductor chip to the set of parametric acceptance criteria. Compliance to the set of parametric acceptance criteria is validated.


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Bickford, Jeanne Paulette Spence. (2009). Method of acceptance for semiconductor devices (U.S. Patent No. 7560946). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7560946

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