The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2009
Filed:
Nov. 07, 2006
Haochuan Wang, South Pasadena, CA (US);
Ali Mehrabi, Glendale, CA (US);
Kouroche Kian, Altadena, CA (US);
Xiaoming He, Arcadia, CA (US);
Stephen LI, Huntington Beach, CA (US);
Haochuan Wang, South Pasadena, CA (US);
Ali Mehrabi, Glendale, CA (US);
Kouroche Kian, Altadena, CA (US);
Xiaoming He, Arcadia, CA (US);
Stephen Li, Huntington Beach, CA (US);
Avery Dennison Corporation, Pasadena, CA (US);
Abstract
A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing a strap lead substrate having a plurality of strap leads disposed thereon; dispensing a first plurality of strap leads from the plurality of strap leads; providing a plurality of pins; bringing the penetrable substrate into close proximity with the strap lead substrate so as to bringing the first plurality of strap leads into contact with the plurality of dies; pressing the first plurality of strap leads against the plurality of dies using the plurality of pins; and, moving the penetrable substrate away from the strap lead substrate while using the plurality of pins to maintain contact between the first plurality of strap leads and the plurality of dies. An apparatus for assembling a semiconductor device is also disclosed.