The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2009
Filed:
Apr. 14, 2004
Hiroya Kobayashi, Hamamatsu, JP;
Hiroshi Akahori, Hamamatsu, JP;
Masaharu Muramatsu, Hamamatsu, JP;
Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;
Abstract
A CCD portionis formed on a front surface side of a semiconductor substrate. A region of a back surface side of semiconductor substratethat corresponds to CCD portionis thinned while leaving peripheral regionsof the region, and an accumulation layeris formed on the back surface side of semiconductor substrate. An electrical wiring, which is electrically connected to CCD portion, and an electrode pad, which is electrically connected to electrical wiring, are then formed on a regionof the front surface side of semiconductor substratethat corresponds to a peripheral region, and a supporting substrateis adhered onto the front surface side of semiconductor substrateso as to cover CCD portionwhile leaving electrode padexposed. Semiconductor substrateand supporting substrateare then cut at a thinned portion of semiconductor substrateso as to leave peripheral regioncorresponding to regionat which electrical wiringand electrode padare formed.