The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2009

Filed:

Sep. 16, 2004
Applicants:

Kooki Ooyama, Osaka, JP;

Masayoshi Natsume, Osaka, JP;

Keiji Hayashi, Osaka, JP;

Tadao Torii, Osaka, JP;

Inventors:

Kooki Ooyama, Osaka, JP;

Masayoshi Natsume, Osaka, JP;

Keiji Hayashi, Osaka, JP;

Tadao Torii, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 53/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention provides a method of inflation extrusion molding, comprising: introducing one or more resin materials extruded from one or more extruders into a die; subsequently extruding the resin material(s) from the die and inflating the extrudate into a cylindrical shape having a predetermined diameter by blown-film extrusion; and then passing the cylindrical inflated resin material through a space between stabilizers which face each other at a predetermined angle, to deform the cylindrical resin material into a flat tube shape having an elongated elliptic section, thereby producing a film or sheet having a predetermined width, wherein the deformation of the cylindrical inflated resin material into a flat tube shape having an elongated elliptic section is assisted by a guide device to thereby facilitate the deformation.


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