The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2009

Filed:

Aug. 03, 2006
Applicants:

Tay-jian Liu, Tu-Cheng, TW;

Chih-hsien Sun, Tu-Cheng, TW;

Chao-nien Tung, Tu-Cheng, TW;

Chuen-shu Hou, Tu-Cheng, TW;

Inventors:

Tay-Jian Liu, Tu-Cheng, TW;

Chih-Hsien Sun, Tu-Cheng, TW;

Chao-Nien Tung, Tu-Cheng, TW;

Chuen-Shu Hou, Tu-Cheng, TW;

Assignee:

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 1/16 (2006.01); G01K 25/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion and slideably receives the movable portion therein for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement the movable portion relative to the immovable portion.


Find Patent Forward Citations

Loading…