The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2009
Filed:
Feb. 19, 2003
Masaru Takada, Ogaki, JP;
Kiyotaka Tsukada, Ogaki, JP;
Hiroyuki Kobayashi, Ogaki, JP;
Hisashi Minoura, Ogaki, JP;
Yoshikazu Ukai, Ogaki, JP;
Mitsuhiro Kondo, Ogaki, JP;
Masaru Takada, Ogaki, JP;
Kiyotaka Tsukada, Ogaki, JP;
Hiroyuki Kobayashi, Ogaki, JP;
Hisashi Minoura, Ogaki, JP;
Yoshikazu Ukai, Ogaki, JP;
Mitsuhiro Kondo, Ogaki, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A method of producing a printed wiring board comprising innerlayer conductor circuits among insulating layers and blind via-holes formed by irradiating laser beams from the outermost surface of the insulating layer toward the innerlayer conductor circuit. A central portion of the innerlayer conductor circuit contains a previously formed opening hole located at the bottom of the blind via-hole. Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits and the blind via-holes.