The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2009

Filed:

Nov. 03, 2005
Applicants:

William Handley, Chandler, AZ (US);

Edoardo Campini, Mesa, AZ (US);

Javier Leija, Chandler, AZ (US);

Inventors:

William Handley, Chandler, AZ (US);

Edoardo Campini, Mesa, AZ (US);

Javier Leija, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A thermal management device attachment apparatus may be used to thermally couple a thermal management device to a heat generating component on a circuit board. The attachment apparatus may include a support member mounted on the same side of the circuit board as the heat generating component and extending around at least a portion of the component. The support member may include a circuit board mounting portion, a thermal management mounting portion and a side portion extending between the circuit board mounting portion and the thermal management mounting portion. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.


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