The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7547645 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 16, 2009

Filed:

Aug. 16, 2006
Applicants:

Michael Bauer, Nittendorf, DE;

Ludwig Heitzer, Regensburg, DE;

Jens Pohl, Bernhardswald, DE;

Peter Strobel, Regensburg, DE;

Christian Stuempfl, Schwandorf, DE;

Inventors:

Michael Bauer, Nittendorf, DE;

Ludwig Heitzer, Regensburg, DE;

Jens Pohl, Bernhardswald, DE;

Peter Strobel, Regensburg, DE;

Christian Stuempfl, Schwandorf, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for coating a structure that includes at least one semiconductor chip involves electrostatically depositing coating particles on the areas of the structure to be coated. The coating particles are first applied to a carrier and the latter is electrostatically charged with the coating particles. The structure including at least one semiconductor chip is charged electrostatically to a polarity opposite to the carrier. The carrier and/or the structure are then moved towards one another in the direction of an area of the structure to be coated until the coating particles jump to the areas of the structure to be coated and adhere there. The coating particles are liquefied by heating the area with coating particles to form a coating.


Find Patent Forward Citations

Loading…