The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2009

Filed:

Feb. 28, 2006
Applicants:

Yumi Imamura, Tokyo, JP;

Kenji Yamamoto, Tokyo, JP;

Tomohiro Murakami, Tokyo, JP;

Inventors:

Yumi Imamura, Tokyo, JP;

Kenji Yamamoto, Tokyo, JP;

Tomohiro Murakami, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/48 (2006.01); H01R 43/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

It is suppressed that a whisker occurs on a lead for external connection. A lead for external connection is formed of the alloy (42Alloy) of Fe and Ni, and a plating film which includes alloy of Sn and Cu is formed on the surface. Next, using a heat-treat furnace, the heat treatment at the temperature beyond melting-point Tof the plating film is performed, and the plating film is melted. At this time, the temperature beyond Tis held for 20 seconds or more. The grain boundary of the plating film can be vanished by the above-mentioned heat treatment. Hereby, the internal stress of the plating film can be eased, and the generation of the whisker can be suppressed.


Find Patent Forward Citations

Imamura, Yumi. (2009). Manufacturing method of a semiconductor device to suppress generation of whiskers (U.S. Patent No. 7547581). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7547581

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