The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2009

Filed:

Jan. 26, 2007
Applicants:

Chang-shen Chang, Taipei Hsien, TW;

Juei-khai Liu, Taipei Hsien, TW;

Chao-hao Wang, Taipei Hsien, TW;

Hsien-sheng Pei, Taipei Hsien, TW;

Inventors:

Chang-Shen Chang, Taipei Hsien, TW;

Juei-Khai Liu, Taipei Hsien, TW;

Chao-Hao Wang, Taipei Hsien, TW;

Hsien-Sheng Pei, Taipei Hsien, TW;

Assignee:

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A light-emitting diode (LED) assembly includes a circuit board (), at least one LED () being electrically connected with and being arranged on a side of the circuit board, and a heat dissipation apparatus () being arranged on an opposite side of the circuit board. The circuit board defines at least one through hole () corresponding to a position of the at least one LED. Thermal interface material () is filled in the at least one hole of the circuit board to thermally interconnect the at least one LED and the heat dissipation apparatus. The thermal interface material is a composition of nano-material and macromolecular material.


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