The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2009
Filed:
Aug. 21, 2006
Ravi Nalla, Chandler, AZ (US);
Charavana Gurumurthy, Higley, AZ (US);
Ravi Nalla, Chandler, AZ (US);
Charavana Gurumurthy, Higley, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An electronic package includes a substrate () and a solder resist layer () over the substrate. The solder resist layer has a plurality of solder resist openings () therein. The electronic package further includes a finish layer () in the solder resist openings, an electrically conducting layer () in the solder resist openings over the finish layer, and a solder material () in the solder resist openings over the electrically conducting layer. The electrically conducting layer electrically connects the solder resist openings in order to enable the electrokinetic deposition of the solder material.