The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2009
Filed:
Jun. 23, 2005
Robert L. Borwick, Thousand Oaks, CA (US);
Philip A. Stupar, Oxnard, CA (US);
Jeffrey F. Denatale, Thousand Oaks, CA (US);
Chailun Tsai, Thousand Oaks, CA (US);
Zhimin J. Yao, Thousand Oaks, CA (US);
Kathleen Garrett, Woodland Hills, CA (US);
John White, Lancaster, CA (US);
Les Warren, Thousand Oaks, CA (US);
Morgan Tench, Camarillo, CA (US);
Robert L. Borwick, Thousand Oaks, CA (US);
Philip A. Stupar, Oxnard, CA (US);
Jeffrey F. DeNatale, Thousand Oaks, CA (US);
Chailun Tsai, Thousand Oaks, CA (US);
Zhimin J. Yao, Thousand Oaks, CA (US);
Kathleen Garrett, Woodland Hills, CA (US);
John White, Lancaster, CA (US);
Les Warren, Thousand Oaks, CA (US);
Morgan Tench, Camarillo, CA (US);
Teledyne Scientific & Imaging, LLC, Thousand Oaks, CA (US);
Abstract
Embodiments of the present invention are directed to a process for forming small diameter vias at low temperatures. In preferred embodiments, through-substrate vias are fabricated by forming a through-substrate via; and depositing conductive material into the via by means of a flowing solution plating technique, wherein the conductive material releases a gas that pushes the conductive material through the via to facilitate plating the via with the conductive material. In preferred embodiments, the fabrication of the substrate is conducted at low temperatures.