The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2009

Filed:

Jul. 27, 2006
Applicants:

Tay-jian Liu, Tu-Cheng, TW;

Chih-hsien Sun, Tu-Cheng, TW;

Chao-nien Tung, Tu-Cheng, TW;

Chuen-shu Hou, Tu-Cheng, TW;

Keng-han Liu, Tu-Cheng, TW;

Inventors:

Tay-Jian Liu, Tu-Cheng, TW;

Chih-Hsien Sun, Tu-Cheng, TW;

Chao-Nien Tung, Tu-Cheng, TW;

Chuen-Shu Hou, Tu-Cheng, TW;

Keng-Han Liu, Tu-Cheng, TW;

Assignee:

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 1/16 (2006.01); G01N 25/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe. A positioning structure extends from at least one of the immovable portion and the movable portion to ensure that the receiving structure is capable of precisely receiving the heat pipe therein. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space for movement of the movable portion relative to the immovable portion.


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