The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2009

Filed:

Apr. 25, 2006
Applicants:

Chien-chih Sung, Taichung, TW;

Chung-pao Wang, Taichung, TW;

Yung-chuan Ku, Taichung Hsien, TW;

Inventors:

Chien-Chih Sung, Taichung, TW;

Chung-Pao Wang, Taichung, TW;

Yung-Chuan Ku, Taichung Hsien, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multichip stacking structure is provided, including a chip carrier; a plurality of semiconductor chips stacked on the chip carrier in a stepped manner that an overlying chip mounted on an underlying chip of the plurality of semiconductor chips has a suspended portion free of being in contact with the underlying chip; and a bump mounted on the chip carrier at a position corresponding to a suspended side of the stacked semiconductor chips where the suspended portion of the overlying chip is located. The bump can serve as a blocking member or a filling member to prevent the semiconductor chips from delamination or formation of voids during a molding process.


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