The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2009

Filed:

Oct. 11, 2006
Applicants:

Jim Chin-nan NI, San Jose, CA (US);

Abraham C. MA, Fremont, CA (US);

Paul Hsueh, Concord, CA (US);

Ming-shiang Shen, Taipei Hsien, TW;

Inventors:

Jim Chin-Nan Ni, San Jose, CA (US);

Abraham C. Ma, Fremont, CA (US);

Paul Hsueh, Concord, CA (US);

Ming-Shiang Shen, Taipei Hsien, TW;

Assignee:

Super Talent Electronics, Inc., San Jose, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/34 (2006.01); H01L 29/68 (2006.01);
U.S. Cl.
CPC ...
Abstract

A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an input/output interface circuit to an external computer over a Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Supporting end ribs under each of the SD contact pads and middle ribs support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB, and slants downward at the insertion end to position the SD contact pads near the centerline.


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