The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2009
Filed:
Oct. 21, 2004
Seong-yong Hwang, Suwon-si, KR;
Weon-sik OH, Yongin-si, KR;
Ju-young Yoon, Yongin-si, KR;
Sung-lak Choi, Osan-si, KR;
Chun-ho Song, Seoul, KR;
Seong-Yong Hwang, Suwon-si, KR;
Weon-Sik Oh, Yongin-si, KR;
Ju-Young Yoon, Yongin-si, KR;
Sung-Lak Choi, Osan-si, KR;
Chun-Ho Song, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Abstract
In an anisotropic conductive film including conductive particles, and a bump, and a packaging structure of a semiconductor chip having the anisotropic conductive film and the bump, the anisotropic conductive film includes a resin layer and the conductive particles. The anisotropic conductive film electrically connects an electrode of a substrate and the bump of a semiconductor chip. A volume ratio of the conductive particles to the resin layer is about 0.1 to about 0.12. A number of the conductive particles per cubic millimeter (mm) is about 4 millions to about 7 millions. A standard deviation of heights of the bumps is no more than about 0.25. An interval between each of the bumps and an electrode of the substrate is no more than about 1.3 μm. Therefore, the size of each of the conductive particles is optimized so that a failure probability of the open circuit is decreased.