The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2009
Filed:
May. 07, 2007
Keiichi Kajiyama, Tokyo, JP;
Tadato Nagasawa, Tokyo, JP;
Keiichi Kajiyama, Tokyo, JP;
Tadato Nagasawa, Tokyo, JP;
Disco Corporation, Tokyo, JP;
Abstract
A method of processing a wafer having a device area in which a plurality of devise are formed and a peripheral excess area surrounding the device area on the front surface, comprising an annular groove forming step for forming an annular groove having a predetermined depth and a predetermined width at the boundary between the device area and the peripheral excess area in the rear surface of the wafer by positioning a cutting blade at the boundary; and a reinforcement forming step for grinding an area corresponding to the device area on the rear surface of the wafer in which the annular groove has been formed, to reduce the thickness of the device area to a predetermined thickness and allowing an area corresponding to the peripheral excess area on the rear surface of the wafer to be left behind to form an annular reinforcement.