The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2009
Filed:
Mar. 27, 2007
Douglas Collins, Albuquerque, NM (US);
Linlin Liu, Hillsborough, NJ (US);
Elaine Taylor, Albuquerque, NM (US);
Douglas Collins, Albuquerque, NM (US);
Linlin Liu, Hillsborough, NJ (US);
Elaine Taylor, Albuquerque, NM (US);
Emcore Corporation, Albuquerque, NM (US);
Abstract
A semiconductor wafer that includes a plurality of groups of active devices or circuits on a first side of the wafer and a patterned electrical contact on the backside of the wafer. Each group consisting of an active device or circuit is intended to be diced into a discrete chip. The backside of the wafer includes a metal layer patterned into discrete spaced-apart deposits that form an electrical contact to the semiconductor and the respective group of active devices. The deposits are not contiguously or laterally connected to each other and function to protect the metal layer from peeling or detaching from the wafer during dicing of the semiconductor wafer into chips.