The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2009
Filed:
Apr. 25, 2006
Applicants:
Tomoki Kobayashi, Nagano, JP;
Toshiji Shimada, Nagano, JP;
Akinobu Inoue, Nagano, JP;
Atsunori Kajiki, Nagano, JP;
Hiroyuki Kato, Nagano, JP;
Hiroshi Shimizu, Nagano, JP;
Inventors:
Tomoki Kobayashi, Nagano, JP;
Toshiji Shimada, Nagano, JP;
Akinobu Inoue, Nagano, JP;
Atsunori Kajiki, Nagano, JP;
Hiroyuki Kato, Nagano, JP;
Hiroshi Shimizu, Nagano, JP;
Assignee:
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A resin layer in which adhesion to a conductive film is higher than that of a sealing resin to the conductive film is disposed on the sealing resin in which it is difficult to form the conductive film, and wiring patterns electrically connected to electronic components are disposed on the resin layer.