The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2009
Filed:
Apr. 19, 2005
Satoru Konishi, Saku, JP;
Tsuneo Endo, Komoro, JP;
Hirokazu Nakajima, Saku, JP;
Yasunari Umemoto, Sayama, JP;
Satoshi Sasaki, Takasaki, JP;
Chushiro Kusano, Niiza, JP;
Yoshinori Imamura, Sagamiko, JP;
Atsushi Kurokawa, Takasaki, JP;
Satoru Konishi, Saku, JP;
Tsuneo Endo, Komoro, JP;
Hirokazu Nakajima, Saku, JP;
Yasunari Umemoto, Sayama, JP;
Satoshi Sasaki, Takasaki, JP;
Chushiro Kusano, Niiza, JP;
Yoshinori Imamura, Sagamiko, JP;
Atsushi Kurokawa, Takasaki, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A semiconductor device has an external wiring for GND formed over an underside surface of a wiring substrate. A plurality of via holes connecting to the external wiring for GND are formed to penetrate the wiring substrate. A first semiconductor chip of high power consumption, including HBTs, is mounted over a principal surface of the wiring substrate. The emitter bump electrode of the first semiconductor chip is connected in common with emitter electrodes of a plurality of HBTs formed in the first semiconductor chip. The emitter bump electrode is extended in a direction in which the HBTs line up. The first semiconductor chip is mounted over the wiring substrate so that a plurality of the via holes are connected with the emitter bump electrode. A second semiconductor chip lower in heat dissipation value than the first semiconductor chip is mounted over the first semiconductor chip.