The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2009
Filed:
Oct. 31, 2007
Ward Scott, Chandler, AZ (US);
Hong Xie, Phoenix, AZ (US);
Ioan Sauciuc, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Disclosed is a socket assembly comprising a retention mechanism, a circuit board, an IC socket, a heat sink unit and a loading mechanism. The retention mechanism includes a support plate, on which the circuit board, the IC socket comprising die and package, and the heat sink unit are stacked respectively. The retention mechanism further includes a plurality of standoffs perpendicular to the support plate and include a pair of latches at different heights. The loading mechanism includes a loading plate configured on end portions of the standoffs and a pair of downwardly extending clips that are capable of engaging to the latches on the both standoffs. Correspondingly, the circuit board, the IC socket and the heat sink unit are sandwiched between the loading plate and the support plate. The heights of the pair of latches on the standoffs are based on the die and package in the IC socket.