The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2009
Filed:
Apr. 17, 2006
Subarnarekha Sinha, Menlo Park, CA (US);
Jianfeng Luo, Fremont, CA (US);
Charles C. Chiang, San Jose, CA (US);
Subarnarekha Sinha, Menlo Park, CA (US);
Jianfeng Luo, Fremont, CA (US);
Charles C. Chiang, San Jose, CA (US);
Synopsys, Inc., Mountain View, CA (US);
Abstract
The use of smooth post-ECP topography (instead of final chip topography) as an objective during dummy filling enables a computationally efficient model-based dummy filling solution for copper while maintaining solution quality. A layout can be divided into tiles and the 'case' of each tile identified. Exemplary cases can include conformal fill, over fill, super fill, or super/over fill (if the ECP model cannot distinguish between super and over fill cases). One or more undesired tile cases can be converted to a desired tile case. Then, a height difference between tiles can be minimized. Dummy features can be inserted in the layout to perform the conversion and to minimize the height difference between tiles. Minimizing the CMP-effective density difference between tiles with ECP considerations can be performed to further improve planarization.