The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2009
Filed:
May. 18, 2006
James Douglas Wehrly, Jr., Austin, TX (US);
Ron Orris, Austin, TX (US);
Leland Szewerenko, Austin, TX (US);
Tim Roy, Driftwood, TX (US);
Julian Partridge, Austin, TX (US);
David L. Roper, Austin, TX (US);
James Douglas Wehrly, Jr., Austin, TX (US);
Ron Orris, Austin, TX (US);
Leland Szewerenko, Austin, TX (US);
Tim Roy, Driftwood, TX (US);
Julian Partridge, Austin, TX (US);
David L. Roper, Austin, TX (US);
Entorian Technologies, LP, Austin, TX (US);
Abstract
The present invention provides a system and method for combining a leaded package IC and a semiconductor die using a flex circuitry to reduce footprint for the combination. A leaded IC package is disposed along the obverse side of a flex circuit. In a preferred embodiment, leads of the leaded IC package are configured to allow the lower surface of the body of the leaded IC package to contact the surface of the flex circuitry either directly or indirectly through an adhesive. A semiconductor die is connected to the reverse side of the flex circuit. In one embodiment, the semiconductor die is disposed on the reverse side of the flex while, in an alternative embodiment, the semiconductor die is disposed into a window in the flex circuit to rest directly or indirectly upon the body of the leaded IC package. Module contacts are provided in a variety of configurations. In a preferred embodiment, the leaded IC package is a flash memory and the semiconductor die is a controller.