The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2009
Filed:
Mar. 23, 2007
Keith E. Barton, Hyde Park, NY (US);
Thomas A. Bauer, Poughkeepsie, NY (US);
Stanley J. Klepeis, Poughkeepsie, NY (US);
John A. Miller, Wallkill, NY (US);
Yun-yu Wang, Poughquag, NY (US);
Keith E. Barton, Hyde Park, NY (US);
Thomas A. Bauer, Poughkeepsie, NY (US);
Stanley J. Klepeis, Poughkeepsie, NY (US);
John A. Miller, Wallkill, NY (US);
Yun-Yu Wang, Poughquag, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Methods of uniformly delayering an IC chip are disclosed. One embodiment includes: performing an ash on the wafer including an Al layer thereof and etching the Al layer; polishing an edge of the wafer using a slurry including an approximately 30 μm polishing particles; removing the aluminum layer and at least one metal layer by polishing using a slurry including approximately 9 μm diamond polishing particles and a non-abrasive backside of a polishing sheet; removing any remaining metal layers to a first metal layer by polishing using a slurry including approximately 3 μm diamond polishing particles and the non-abrasive backside of a polishing sheet; removing any scratches by polishing using a slurry including approximately 1 μm diamond polishing particles and the non-abrasive backside of a polishing sheet; and removing the first metal layer to a polyconductor layer by polishing using a colloidal slurry including approximately 0.25 μm diamond polishing particles.