The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2009
Filed:
Nov. 17, 2006
Minoru Ametani, Mitaka, JP;
Minoru Ametani, Mitaka, JP;
Tokyo Seimitsu Co., Ltd., Tokyo, JP;
Abstract
A dicing tape attaching apparatus () comprises a fixed table () for supporting a mount frame (), a movable table () for supporting a wafer () with the reverse surface thereof ground, and a height adjusting unit () such as a screw jack for adjusting the height of the movable table. When the dicing tape () is attached on the mount frame and the wafer, the height adjusting unit such as the screw jack so operates that the height of the dicing tape attaching surface of the wafer supported on the movable table coincides with the height of the upper surface of the mount frame supported on the fixed table. As a result, the wafer is prevented from forming cuts, cracks and internal distortions.