The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2009

Filed:

Mar. 15, 2005
Applicants:

Paul G. Sudak, Lucas, TX (US);

Robert L. Adams, Plano, TX (US);

Jason M. Neidrich, Allen, TX (US);

Simon Joshua Jacobs, Lucas, TX (US);

Lisa Ann Wesneski, The Colony, TX (US);

Linda M. Wills, Rowlett, TX (US);

William D. Carter, Allen, TX (US);

Judith C. Frederic, Plano, TX (US);

Inventors:

Paul G. Sudak, Lucas, TX (US);

Robert L. Adams, Plano, TX (US);

Jason M. Neidrich, Allen, TX (US);

Simon Joshua Jacobs, Lucas, TX (US);

Lisa Ann Wesneski, The Colony, TX (US);

Linda M. Wills, Rowlett, TX (US);

William D. Carter, Allen, TX (US);

Judith C. Frederic, Plano, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/03 (2006.01); G02F 1/07 (2006.01); G02F 1/29 (2006.01); G02B 26/00 (2006.01); G02B 26/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to one embodiment of the present invention, a semiconductor device includes a first layer of dielectric material disposed upon an upper surface of a substrate of a semiconductor device and a first non-conductive layer of metal disposed upon an upper surface of the dielectric material. The first layer of dielectric material and the first non-conductive layer of metal act as an optical trap for electromagnetic radiation received by the first non-conductive layer of metal. In particular embodiments, the semiconductor device may further comprise a second layer of dielectric material disposed upon an upper surface of the first non-conductive layer of metal and a second non-conductive layer of metal disposed upon an upper surface of the second layer of dielectric material.


Find Patent Forward Citations

Loading…