The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2009
Filed:
Nov. 03, 2006
Jing Zhang, Shenzhen, CN;
Yeu-lih Lin, Taipei Hsien, TW;
Chin-lung Chen, Taipei Hsien, TW;
Ming-liang Hao, Shenzhen, CN;
Ming Yang, Shenzhen, CN;
Jing Zhang, Shenzhen, CN;
Yeu-Lih Lin, Taipei Hsien, TW;
Chin-Lung Chen, Taipei Hsien, TW;
Ming-Liang Hao, Shenzhen, CN;
Ming Yang, Shenzhen, CN;
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;
Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;
Abstract
A heat-pipe type heat sink () includes a plurality of fins (), at least a heat pipe () extending through the fins, and soldering material () disposed between the heat pipe and the fins. Each of the fins defines therein a through hole () and a cutout () adjacent to the through hole. A sidewall of the through hole forms a collar () contacting with the heat pipe, whilst a sidewall of the cutout forms at least a fringe () connecting with the collar. The fringe guides the soldering material in molten state to flow from the cutout towards the collar to fill in a gap formed between the heat pipe and the fins to bond the heat pipe and the fins together after the molten soldering material is cooled.