The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2009
Filed:
Aug. 13, 2007
Applicants:
Timothy G. Dunham, South Burlington, VT (US);
Ezra D. B. Hall, Richmond, VT (US);
Howard S. Landis, Underhill, VT (US);
Mark A. Lavin, Katonah, NY (US);
William C. Leipold, Enosburg Falls, VT (US);
Inventors:
Timothy G. Dunham, South Burlington, VT (US);
Ezra D. B. Hall, Richmond, VT (US);
Howard S. Landis, Underhill, VT (US);
Mark A. Lavin, Katonah, NY (US);
William C. Leipold, Enosburg Falls, VT (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
An interconnect structure, method of fabricating the interconnect structure and method of designing the interconnect structure for use in semiconductor devices. The interconnect structure includes a damascene metal wire having a pattern of dielectric filled holes.