The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2009
Filed:
Mar. 29, 2007
Applicants:
Robert Martinson, Hillsboro, OR (US);
Tieyu Zheng, Chandler, AZ (US);
Inventors:
Robert Martinson, Hillsboro, OR (US);
Tieyu Zheng, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A land grid array socket and a microelectronic assembly including the socket. The socket comprises: a housing; an array of through-contacts on the housing; a solder ball standoff element on a PCB side of the housing; and a seating plane standoff element on a package side of the housing, the seating plane standoff element being aligned with the solder ball standoff element to form a loading force support element therewith.