The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2009
Filed:
Nov. 28, 2005
Kojiro Kameyama, Gunma, JP;
Akira Suzuki, Gunma, JP;
Yoshio Okayama, Sunnyvale, CA (US);
Mitsuo Umemoto, Gunma, JP;
Kojiro Kameyama, Gunma, JP;
Akira Suzuki, Gunma, JP;
Yoshio Okayama, Sunnyvale, CA (US);
Mitsuo Umemoto, Gunma, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Kanto Sanyo Semiconductors Co., Ltd., Gunma, JP;
Abstract
The invention provides an electrostatically chucking technology capable of chucking a workpiece formed of an insulator or a workpiece attached with an object to be processed such as a semiconductor wafer on a stage. A layered body attached with a glass substrate for supporting a semiconductor substrate having an electronic device on its surface is prepared, and a conductive film is attached thereto. Then, the layered body is set on a surface of a stage set in a vacuum chamber such as a dry-etching apparatus. After then, a voltage is applied to an internal electrode to generate positive and negative electric charges on the surfaces of the conductive film and the stage, and the layered body is chucked with static electricity generated therebetween. Then, the layered body chucked on the stage is processed by etching, CVD, or PVD.