The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2009
Filed:
Mar. 16, 2005
Applicants:
Ryosuke Usui, Ichinomiya, JP;
Atsuhiro Nishida, Ohgaki, JP;
Hideki Mizuhara, Bisai, JP;
Takeshi Nakamura, Gunma, JP;
Inventors:
Ryosuke Usui, Ichinomiya, JP;
Atsuhiro Nishida, Ohgaki, JP;
Hideki Mizuhara, Bisai, JP;
Takeshi Nakamura, Gunma, JP;
Assignee:
Sanyo Electric Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor apparatus includes a substrate and elements or semiconductor chips provided on the substrate. The elements are sealed by being brought into contact with a sealing compound. The surface of contact on the elements or the sealing compound is plasma treated. The semiconductor chip is adhesively attached to another semiconductor chip via an adhesive compound. The surface of the semiconductor chip in contact with the adhesive compound is plasma treated.