The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7494919 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 24, 2009

Filed:

Jan. 12, 2005
Applicants:

Colin J. Brodsky, Salt Point, NY (US);

Scott D. Allen, Ledgewood, NJ (US);

Inventors:

Colin J. Brodsky, Salt Point, NY (US);

Scott D. Allen, Ledgewood, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for reducing the size of a patterned semiconductor feature includes forming a first layer over a substrate to be patterned, and forming a photoresist layer over the first layer. The photoresist layer is patterned so as to expose portions of the first layer, and the exposed portions of the first layer are removed in a manner so as to create an undercut region beneath the patterned photoresist layer. The patterned photoresist layer is reflowed so as to cause reflowed portions of the patterned photoresist layer to occupy at least a portion of the undercut region.


Find Patent Forward Citations

Brodsky, Colin. (2009). Method for post lithographic critical dimension shrinking using thermal reflow process (U.S. Patent No. 7494919). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7494919

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…