The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2009
Filed:
Aug. 15, 2005
Gotthard Jungnickel, Radeberg, DE;
Frank Kuechenmeister, Dresden, DE;
Daniel Richter, Radebeul, DE;
Marcel Wieland, Radebeul, DE;
Gotthard Jungnickel, Radeberg, DE;
Frank Kuechenmeister, Dresden, DE;
Daniel Richter, Radebeul, DE;
Marcel Wieland, Radebeul, DE;
Advanced Micro Devices, Inc., Austin, TX (US);
Abstract
The present invention provides a new technology approach for forming a contact layer in a microelectronic chip, which includes a plurality of solder bumps that are directly to be connected with a correspondingly designed carrier substrate. In the process flow, a plasma-based process for patterning the underbump metallization layer is used in combination with testing and assembling the device, thereby providing a high degree of process flexibility and/or cost reduction and/or device performance.