The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2009
Filed:
Sep. 27, 2004
Yoshitake Hayashi, Kadoma, JP;
Masayoshi Koyama, Kadoma, JP;
Satoru Yuhaku, Kadoma, JP;
Kazuo Otani, Kadoma, JP;
Susumu Matsuoka, Kadoma, JP;
Yasushi Taniguchi, Kadoma, JP;
Seiichi Nakatani, Kadoma, JP;
Yoshitake Hayashi, Kadoma, JP;
Masayoshi Koyama, Kadoma, JP;
Satoru Yuhaku, Kadoma, JP;
Kazuo Otani, Kadoma, JP;
Susumu Matsuoka, Kadoma, JP;
Yasushi Taniguchi, Kadoma, JP;
Seiichi Nakatani, Kadoma, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.