The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2009
Filed:
Apr. 22, 2004
Applicants:
Ching Man Tsui, Hong Kong, CN;
Lap Kei Chow, Hong Kong, CN;
Hui Fai Ho, Hong Kong, CN;
Cam Nguyen Ronald Ngo, Hong Kong, CN;
Inventors:
Ching Man Tsui, Hong Kong, CN;
Lap Kei Chow, Hong Kong, CN;
Hui Fai Ho, Hong Kong, CN;
Cam Nguyen Ronald Ngo, Hong Kong, CN;
Assignee:
ASM Assembly Automation Limited, Kwai Chung, HK;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
An apparatus supports, during a testing operation, a leadframe formed with at least one row of non-singulated semiconductor devices. The apparatus includes a main body and a leadframe support member, and the leadframe support is formed with at least one groove for receiving semiconductor devices such that in use leads extending from the semiconductor devices lie on a surface of the support member.