The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2009
Filed:
Feb. 27, 2006
Kojiro Kameyama, Ota, JP;
Akira Suzuki, Ota, JP;
Yoshio Okayama, Sunnyvale, CA (US);
Mitsuo Umemoto, Gunma, JP;
Kojiro Kameyama, Ota, JP;
Akira Suzuki, Ota, JP;
Yoshio Okayama, Sunnyvale, CA (US);
Mitsuo Umemoto, Gunma, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
A semiconductor device with improved reliability and its manufacturing method is offered. The semiconductor device of this invention includes a pad electrode formed on a semiconductor substrate through a first insulation layer, and a via hole formed in the semiconductor substrate and extending from a back surface of the semiconductor substrate to the pad electrode, wherein the via hole includes a first opening of which a diameter in a portion close to the pad electrode is larger than a diameter in a portion close to the back surface of the semiconductor substrate, and a second opening formed in the first insulation layer and continuing from the first opening, of which a diameter in a portion close to the pad electrode is smaller than a diameter in a portion close to the front surface of the semiconductor substrate.