The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2009
Filed:
Feb. 10, 2005
Yoshiharu Hidaka, Takatsuki, JP;
Etsuro Kishio, Kyoto, JP;
Yoshiharu Hidaka, Takatsuki, JP;
Etsuro Kishio, Kyoto, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A semiconductor substrate is inserted into a heat treatment apparatus at a low temperature ranging from room temperature to about 50° C., and organic substances included in a metal on the semiconductor substrate are released without carbonization in an annealing process before CMP. Further, organic substances capable of preventing the corrosion of the metal are decomposed, and the organic substances themselves and chlorine, sulfuric acid, and ammonia which are included in the organic substances are diffused out of the metal film by setting the heat treatment apparatus at a rate of temperature rise of 15° C./min or less until a prescribed heat treatment temperature is reached.